
XPENG is a global technology company focused on Physical AI. We develop core technologies in-house to shape the future of mobility and bring intelligent experiences to more people. Through XPENG AI ENGINEERING, we collaborate with automotive partners worldwide on modular and integrated vehicle solutions, supporting R&D, production and after-sales service. Our flexible collaboration models enable us to work with partners to integrate solutions into their existing systems, enhance product capabilities and improve efficiency across the vehicle lifecycle. Guided by our vision of "Physical AI for All," we combine our technology and engineering expertise with our partners' strengths in manufacturing, supply chains and local markets. Together, we aim to turn technological change into shared opportunity, bring better products to market and make intelligent mobility more accessible.
XPENG’s vehicle platform solutions draw on our experience in developing and delivering smart EVs to markets worldwide. With scalable architectures supporting multiple vehicle segments and body styles, we work with OEM partners to develop products tailored to their brand positioning and local customer needs. Our production vehicles meet applicable regulatory requirements across a range of markets, including China, Europe, the Gulf region, South Korea and Brazil. This experience encompasses applicable UNECE regulations and market-specific requirements, providing a practical foundation for vehicle development and adaptation with partners worldwide. Multiple XPENG models have achieved five-star Euro NCAP ratings, demonstrating the safety performance of our production vehicles. Together with our experience in joint vehicle development, these capabilities underpin flexible platform collaboration to help partners bring competitive smart EVs to market.
XPENG brings together in-house AI foundation models and proprietary Turing AI chips to support advanced driver assistance. Built on VLA architecture, the model powering XPENG NGP combines contextual memory, spatial understanding and prediction to respond to changing road conditions. Its generalization capabilities support adaptation across vehicle models and markets, helping reduce additional training requirements and accelerate development. Purpose-built for large AI models, the automotive-grade Turing AI chip provides the computing foundation for efficient on-board inference. By jointly optimizing chip architecture, compilers and AI models, XPENG improves computing resource utilization and coordinates data movement with computation—translating hardware capability into responsive intelligent-driving performance. Through collaboration with OEM partners, we bring these capabilities into vehicle development, supporting model adaptation, system integration and validation for target-market driving conditions. This approach helps partners develop intelligent-driving experiences suited to their products and customers.
XPENG’s remote XCP calibration system connects office-based engineers with test vehicles across locations, supporting calibration throughout vehicle development and testing. Engineers upload calibration files through the cloud from their office. On-site personnel can then confirm and apply the files directly through the vehicle’s built-in display—without an additional dedicated calibration data-input device in the vehicle. Office-based specialists work with on-site teams remotely, reducing the need to travel for calibration support. From everyday development work to seasonal and high-altitude testing, this approach helps teams reduce travel time and costs while keeping engineering expertise accessible across locations.
XPENG X Volkswagen

Since 2023, XPENG and Volkswagen Group have combined complementary strengths across vehicle platforms, software and E/E architecture to develop smart electric vehicles for China.
XPENG contributes its EV platform, connectivity and driver assistance software to joint vehicle development. With VCTC and CARIAD China, XPENG has also jointly developed the China Electronic Architecture (CEA).
Through the Twin Team model, XPENG and Volkswagen engineers work closely together on E/E development. Coordinated roles and development processes support efficient collaboration throughout the project.
In March 2026, the ID.UNYX 08 entered series production in Hefei. The first jointly developed model turns complementary technologies and close engineering collaboration into a production vehicle.
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